HBM suppliers
SK hynix leads HBM with 50% of Q2 2026 revenue, ahead of Samsung at 33% and Micron at 18% (Counterpoint Research). Compare 41 HBM supply-chain suppliers across six stages, from bonders and CoWoS packaging to testers and substrates, with sourced generations, capacity plans and named customers.
Conceptual stack cross-section
| ACM Research | Bonding & TSV1 | Ultra ECP 3d; Ultra ECP ap1 | Platform covers Cu, Ni, SnAg and gold plating for vias, pillars, bumps and RDL1 | — | 2026-11-11 |
|---|---|---|---|---|---|
| Advantest | Test1 | T5503HS21 | Up to 9 Gbps; 16,256 channels; timing accuracy ±45 ps1 | — | 2026-11-11 |
| Ajinomoto Fine-Techno | Substrates & materials1 | Ajinomoto Build-up Film (ABF)1 | Film enables simultaneous processing on both substrate sides1 | — | 2026-11-11 |
| Amkor Technology | Packaging1 | 2.5D/3D TSV packaging1 | MEOL input: 300 mm wafers with pre-formed blind TSVs1 | — | 2026-11-11 |
| Applied Materials | Bonding & TSV1 | Nokota VMax 2; Kinex (with Besi)12 | Platform spans TSV filling and fine-pitch interconnect plating1 | — | 2026-11-11 |
| ASE | Packaging1 | 2.5D/3D IC packaging; FOCoS1 | Published interposer routing line/space: 0.4/0.4 µm1 | — | 2026-11-11 |
| ASMPT | Bonding & TSV1 | FIREBIRD TCB; AOR TCB12 | FIREBIRD placement accuracy: ±2.0 µm1 | HBM3E 12H (installed tools); HBM4 12H (low-volume manufacturing)3 | 2026-11-11 |
| AT&S | Substrates & materials12 | High-end IC substrates; Kulim ABF substrates12 | Kulim technology portfolio includes up to 26 layers and 5 µm line/space1 | — | 2026-11-11 |
| Besi | Bonding & TSV1 | Datacon 8800 CHAMEO ultra plus AC1 | Platform targets high-density interconnects and 3D integration1 | — | 2026-11-11 |
| Camtek | Inspection1 | Hawk1 | Defect sensitivity down to 0.1 µm; more than 500 million bumps per wafer1 | — | 2026-11-11 |
| CXMT | Memory1 | HBM sample chips (reported May 2024)1 | Samples reportedly shown to clients1 | — | 2026-11-11 |
| DISCO | Bonding & TSV1 | DGP8761 grinder/polisher1 | Supports 200 mm and 300 mm wafers; finish thickness 25 µm or less1 | — | 2026-11-11 |
| EBARA | Bonding & TSV12 | F-REX300X CMP; UFP-AS plating1 | F-REX300X: 300 mm wafers; UFP-AS: panels up to 600 × 600 mm1 | — | 2026-11-11 |
| Entegris | Substrates & materials12 | Advanced-packaging CMP pads, slurries and post-CMP cleaning solutions1 | Integrated chemistry, pads, cleaning and process monitoring for surface planarity and defect control1 | — | 2026-11-11 |
| EV Group | Bonding & TSV1 | EVG850 TB1 | Substrate size: up to 300 mm; silicon, glass or sapphire carriers1 | — | 2026-11-11 |
| FormFactor | Test1 | HFTAP K32 on SmartMatrix1 | Up to 3.2 GHz / 6.4 Gbps; fine pitch down to 50 µm1 | HBM3 (listed application)1 | 2026-11-11 |
| HANMI Semiconductor | Bonding & TSV1 | TC Bonder 4.5 Griffin (June 2026 order)2 | Catalogue also lists HBM 6-SIDE INSPECTION 1.01 | HBM4 (reported equipment order)2 | 2026-11-11 |
| Hanwha Semitech | Bonding & TSV12 | SFM5-Expert TC bonder; SHB2 Nano (evaluation-stage hybrid bonder)13 | TC bonders in mass production; hybrid system announced for customer performance testing in H1 202613 | — | 2026-11-11 |
| Henkel | Substrates & materials1 | LOCTITE ECCOBOND NCF 200 series; NCP 52091 | Films target fine-pitch, narrow-gap interconnects in memory and 3D TSV stacks1 | — | 2026-11-11 |
| IBIDEN | Substrates & materials1 | Advanced IC package substrates1 | Ono Plant: sequential mass-production start scheduled from October 2025, primarily for AI server substrates1 | — | 2026-11-11 |
| KLA | Inspection1 | Kronos 1190; ICOS F160XP1 | Kronos uses high-resolution optics for dense packaging patterns1 | — | 2026-11-11 |
| Lam Research | Bonding & TSV1 | Syndion TSV etch; SABRE 3D plating2 | SABRE 3D supports Cu/SnAg and Ni/Au microbumps1 | — | 2026-11-11 |
| Micron Technology | Memory1 | HBM4 36GB 12H reference stack1 | HBM4 bandwidth: greater than 2.8 TB/s per stack1 | HBM3E; HBM4; HBM4E (development; volume production expected in calendar 2027)13 | 2026-11-11 |
| NAMICS | Substrates & materials1 | Liquid Compression Mold Underfill (LCMUF)1 | Commercialized for mass production; resin/filler design balances flowability and warpage1 | — | 2026-11-11 |
| Onto Innovation | Inspection1 | Dragonfly G5; 3Di1 | Dragonfly G5 detects defects as small as 150 nm1 | HBM4 (customer ramp application)1 | 2026-11-11 |
| Resonac | Substrates & materials1 | Non-conductive film (NCF); thermal conductive sheet (TIM)1 | NCF connects stacked HBM layers; TIM supports heat transfer1 | — | 2026-11-11 |
| Samsung Electronics | Memory1 | HBM4 12-layer reference stack1 | HBM4 bandwidth: up to 3.3 TB/s per stack1 | HBM3E; HBM4; HBM4E (samples shipped June 2026)13 | 2026-11-11 |
| SCREEN Semiconductor Solutions | Bonding & TSV12 | SU-3400 single-wafer cleaner1 | Single-wafer cleaning platform for advanced logic and memory processing1 | — | 2026-11-11 |
| SEMES | Bonding & TSV1 | HBM Thermal Compression Bonder1 | NCF-method stacking with alignment control under high bonding loads1 | — | 2026-11-11 |
| Shinko Electric Industries | Substrates & materials1 | i-THOP 2.3D package substrate (under development)1 | Published design rules: 40 µm flip-chip pad pitch; 2/2 µm line/space1 | — | 2026-11-11 |
| SK hynix | Memory1 | HBM3E 12-layer reference stack1 | HBM3E pin speed: 9.6 Gbps1 | HBM3E; HBM4; HBM4E (samples shipped June 2026)25 | 2026-11-11 |
| SPIL | Packaging1 | 2.5D FCBGA with HBM; FO-EB-T FCBGA with HBM1 | Annual report lists both embedded-bridge/TSV and 2.5D HBM packaging1 | — | 2026-11-11 |
| Sumitomo Bakelite | Substrates & materials12 | SUMIKON EME mold underfill; compression-molding granules1 | Resin viscosity and filler distribution tailored for narrow-gap filling and low warpage1 | — | 2026-11-11 |
| SUSS | Bonding & TSV1 | XBS300; XBC3001 | Platforms support the three wafer-support sub-processes for HBM thinning1 | — | 2026-11-11 |
| Teradyne | Test1 | Magnum 7H1 | Up to 4.5 Gbps; 9,216 digital pins and 2,560 power pins1 | HBM3; HBM3E; HBM4; HBM4E1 | 2026-11-11 |
| Tokyo Electron | Bonding & TSV1 | Synapse V; Synapse Z Plus; Synapse Si1 | Synapse Si combines Cu hybrid and fusion bonding processes1 | — | 2026-11-11 |
| Toray Industries | Substrates & materials1 | Temporary bonding material for ultra-thin semiconductor wafers (samples)1 | Targets wafers 30 µm or less in thickness1 | — | 2026-11-11 |
| TOWA | Bonding & TSV1 | CPM series (announced application)1 | Announced technology targets narrow gaps in HBM4 stacks1 | HBM4 (announced process target)1 | 2026-11-11 |
| TSMC | Packaging1 | CoWoS-S; CoWoS-R; CoWoS-L1 | CoWoS-R uses an RDL interposer; in volume production since 20231 | HBM4 (SK hynix base-die collaboration)2 | 2026-11-11 |
| Unimicron | Substrates & materials1 | FC-BGA package substrates1 | 2026 roadmap target: 150 × 150 mm body size and 5/7 µm build-up line/space1 | — | 2026-11-11 |
| Yamaha Robotics (SHINKAWA) | Bonding & TSV1 | FPB-1s NeoForce (SHINKAWA series)1 | Bonding force up to 350 N; handles up to four chip product types1 | — | 2026-11-11 |
Read the stack, then build the shortlist
Method and definitionsBuy at the right layer. Memory makers supply the stack. Packaging firms integrate it with logic. Equipment and materials suppliers serve the manufacturing process. Use the role filter to compare the purchase you need.
Keep the scope attached. Memory per stack, manufacturing capacity and revenue share measure different things. Generation entries label samples and roadmaps. Open the source next to a value for its configuration, status and period.
Check qualification directly. A named platform, a tool evaluation and a production commitment are separate milestones. Send the exact part, process and target date when requesting a quote.
Request supplier quotes
Start with the supplier’s official contact page for availability and qualification. For help preparing a shortlist, email HBM Suppliers with the part, process step, volume and target date.
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HBM sourcing questions
Who makes HBM memory?
SK hynix, Samsung Electronics and Micron Technology make commercial HBM. Counterpoint Research put their Q2 2026 HBM revenue shares at 50%, 33% and 18%. China’s CXMT has reported HBM samples. The memory-makers hub compares their reference stacks, base dies and named customers.
What does TSMC supply around HBM?
TSMC’s CoWoS platform integrates logic and HBM through an interposer. Its agreement with SK hynix also covers HBM4 base-die logic. The packaging hub separates package integration from memory stacking and compares TSMC, Amkor, ASE and SPIL.
Which HBM generation does each tool support?
The generation field shows exactly what the supplier’s own source names, from HBM3 to HBM4E. Qualification is set per device, recipe and customer, so send the exact part and target date with your quote request.
How should capacity and market share be compared?
Reference stack capacity is memory per stack: 36 GB in each 12-layer reference stack listed here. Supply-capacity entries carry dated production news and expansion plans. Market shares carry their research period, revenue metric and publisher. For allocation, request a current quote.
Can I reuse the supplier data?
Download the CSV or JSON with its sources and access dates. The compilation is offered under CC BY 4.0 with attribution to HBM Suppliers; linked documents and product names retain their owners’ rights.
Use and cite the compilation under CC BY 4.0: CSV, JSON, agent guide. Published by Beundra AB.